World Leader in Fully Automated Pavement Survey in Sub-MM 3D

We make Deep-Learning based technology accessible!

Sub-mm 3D Laser Imaging, AI based Automated Pavement Condition Surveys & Potential for Safety Evaluation 

“PAVE 3D 8K DEEP-LEARNING BASED SOLUTIONS”

WayLink Systems Corporation is a U.S. based technology company specializing in automated pavement (highway, roadway, and airfield) data collection and analysis. WayLink s Pave3D 8K technology suite harmoniously integrates leading-edge sub-mm 3D laser imaging hardware, Deep-Learning based software, and decades of combined expertise of its senior staff to serve multitude of clients worldwide. Its technical strengths rooted in several US based research universities.

Its flagship technology CrackNet is the first production-worthy AI based solution for fully automated survey of cracking and other distresses. The new Pave3D 8K laser imaging system provides 0.5-mm resolution in the transverse direction, and 30KHz 3D line rate in the longitudinal direction.

World-leading Pave3D 8K (0.5-mm 3D Sensors), WayLink utilized its experience in automated pavement survey since 1998 & delivered CrackNet in late 2017 based on pixel-level large-scale Deep-Learning (DL) techniques.

Both hardware and software talents at WayLink have demonstrated decades of leadership in pavement surveys. Currently most of pavement distresses (cracking, rutting, patching, sealed-cracking, and pot-holes, others) can be processed in real-time as raw 0.5-mm 2D and 3D data sets are being collected in the data vehicle.

Key Features: 

3D Sensors (Pave3D 8K) 

• 2D/3D Laser Imaging at 0.5-mm transversely
• 30KHz 3D line rare for 1-mm longitudinal resolution at 100 KMH (60 MPH)
• Full-Lane Coverage (4-Meter Width): >8000 3D Transverse Points
• Class-I longitudinal profiling with high-performance accelerometers & IRI (WIS)
• Total vehicular system power consumption: less than 1000 Watts for All 

Deep-Learning (DL) based Software Solutions 

• Full Automation for Cracking, Rutting, Faulting, Macro-Texture, & IRI
• Full Automation for other non-cracking distresses: Patching, Potholes, Sealed Cracks
• Real-Time Processing: on-board GPU processing of raw 3D/2D data for cracking et al
• Airport Pavement Surveys: ASTM Airfield PCI for runways, Boeing Bump, grooves
• Roadway Pavement Surveys: AASHTO R 85-18, ASTM PCI, NCHRP 01-57A, others

website: https://waylink.com/